芯代工——晶圆减薄
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晶圆减薄(5英寸)
晶圆基材:硅基材质 |
总厚度变化TTV:±3μm |
翘曲度Wrap:≤1mm |
粗糙度Ry(2000#):≤0.13μm Ra(2000#):0.065μm |
碎片率(150μm以上):1% |
晶圆减薄(6英寸)
晶圆基材:硅基材质 |
总厚度变化TTV:±3μm |
翘曲度Wrap:≤1mm |
粗糙度Ry(2000#):≤0.13μm Ra(2000#):0.065μm |
碎片率(150μm以上):1% |
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晶圆减薄(8英寸)
晶圆基材:硅基材质 |
总厚度变化TTV:±3μm |
翘曲度Wrap:≤1mm |
粗糙度Ry(2000#):≤0.13μm Ra(2000#):0.065μm |
碎片率(150μm以上):1% |
晶圆减薄(超薄片)
晶圆基材:硅基材质 |
总厚度变化TTV:±3μm |
翘曲度Wrap:≤1mm |
粗糙度Ry(2000#):≤0.13μm Ra(2000#):0.065μm |
碎片率(150μm以上):1% |
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